During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal solution to monitor the wafer thickness in-process. Optical technology also enables profiling of chip-on-wafer and MEMS during grinding.
Whitepaper Spring 2019
Nowadays the laser is a conventional tool used in industrial manufacturing for a wide variety of applications, from subtractive to additive, from cutting to welding. A major topic in production today is digitalisation and Industry 4.0. In this context the laser is playing a dominant role, because it is possible to produce a part directly from a digital model by contactless processing. This unique feature allows monitoring processes with smart devices, which is a key issue of Industry 4.0.
Spring 2019 - The "Laser User" Magazine
Talking about purified assembled printed circuit boards (PCBs), e.g. in automotive industry for control of airbag or anti-lock braking systems (ABS), one of the main issues is the protection against environmental impact. The error-free functionality must be guaranteed even at the North Cape, the Rainforest or in the desert and this warranty has to be provided for even a decade.
Optik & Photonik Volume 12, Issue 3, June 2017.
When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The depanelling system, built by iC-automation,meets this challenge with a combination of confocal optical measuring sensors and and ultrashort pulse laser made by TRUMPF.
Neu-Isenburg (Germany), September 2016
How does the 3D measurement of electronic components work? At first glance, the measuring machines used here look like their relatives from the mechanical world, the high-end coordinate measuring machines. Yet much is different and it starts with the name: We speak of 3D surface measurement systems for microelectronics or microsystems technology, for precision engineering or for the tool industry; and the all-rounders among these can offer several sensor systems. Optical sensors are taking over the lion’s share of the measuring tasks.
Up to four different measuring systems can be found on the sensor carriers of the cyberTECHNOLOGIES 3D surface measurement machines.
Neu-Isenburg (Germany), July 2016
The chromatic CHRocodile C sensor with its robust and integrated design the size of a cigarette pack offers high precision distance and thickness measurements. CHRocodile C is specially suited for industrial inline use and easily integrable into any kind of inspection machine.
Thanks to its compact dimensions and excellent performance/price ratio, CHRocodile C is the ideal alternative to classical laser triangulation sensors.
Neu-Isenburg (Germany), April 2016
Heye International’s Mark Ziegler and Gerd Schütz discuss the importance of wall thickness measurement in the high speed manufacture of lightweight glass containers and the use of CHRocodile chromatic confocal sensors from Precitec Optronik GmbH in Heye cold end inspection machines.
Neu-Isenburg (Germany), 2016
It is almost impossible for the wall thickness of balloons and thin-walled tubes (from which balloon catheters are manufactured) to be measured from the inside. The wall thicknesses can merely be estimated mechanically. But a simple solution exists in the form of optical noncontact measuring techniques which offer thickness measurements as a starting point, because these techniques offer so much more.