During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal solution to monitor the wafer thickness in-process. Optical technology also enables profiling of chip-on-wafer and MEMS during grinding.
Whitepaper Spring 2019
Nowadays the laser is a conventional tool used in industrial manufacturing for a wide variety of applications, from subtractive to additive, from cutting to welding. A major topic in production today is digitalisation and Industry 4.0. In this context the laser is playing a dominant role, because it is possible to produce a part directly from a digital model by contactless processing. This unique feature allows monitoring processes with smart devices, which is a key issue of Industry 4.0.
Spring 2019 - The "Laser User" Magazine
Since 2000 ic-automation GmbH has been producing special machinery. ic-automation now offers standardized flexible wall thickness measuring systems for the container glass industry based on the most advanced chromatic CHRocodile sensors from Precitec Optical Measuring. Read more...
Optical chromatic and interferometric sensors ensure fast and contactless gemoetry, thickness and cosmetic defect inspection at minimum cycle times in mass production. Read more...
Through close co-operation with customers, Precitec Optronik has been a leading innovator in measuring the thickness and topography of glass of any colour or surface structure. According to Daniel Dupraz, recent innovations include the 3D inspection of automotive windscreens. Read more ...
Interferometric surface inspection with movable measurement spot.
Complete 3D measurement of objects using white light interference in mass production is time consuming and therefore
not well-suited for use as a means of inline inspection. In addition, the long measurement cycles with complex sequences
generate large amounts of data and the effort for processing the data must also be included in overall considerations. Read more...
Talking about purified assembled printed circuit boards (PCBs), e.g. in automotive industry for control of airbag or anti-lock braking systems (ABS), one of the main issues is the protection against environmental impact. The error-free functionality must be guaranteed even at the North Cape, the Rainforest or in the desert and this warranty has to be provided for even a decade.
Optik & Photonik Volume 12, Issue 3, June 2017.
When chips are disassembled, a process known as depaneling, precision down to the micrometer is required in both processing and positioning. The depanelling system, built by iC-automation,meets this challenge with a combination of confocal optical measuring sensors and and ultrashort pulse laser made by TRUMPF.
Neu-Isenburg (Germany), September 2016
How does the 3D measurement of electronic components work? At first glance, the measuring machines used here look like their relatives from the mechanical world, the high-end coordinate measuring machines. Yet much is different and it starts with the name: We speak of 3D surface measurement systems for microelectronics or microsystems technology, for precision engineering or for the tool industry; and the all-rounders among these can offer several sensor systems. Optical sensors are taking over the lion’s share of the measuring tasks.
Up to four different measuring systems can be found on the sensor carriers of the cyberTECHNOLOGIES 3D surface measurement machines.
Neu-Isenburg (Germany), July 2016