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ディスプレイオプション

3D 計測

02/01/2024

Dr. Markus Kogel-Hollacher is presenting a paper at this year´s Photonics West

Precitec Optronik Head of R&D and Photonics 100 honouree Dr. Markus Kogel-Hollacher is presenting a paper at this year's Photonics West.
He talked…

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3D 計測

12/13/2023

e-モビリティの開発においてレーザープロセスがこれほど重要な役割を果たすのはなぜですか?

フォトニクス、特にレーザーとセンサーは、今後数年間でバッテリー市場で重要な役割を果たす態勢が整っています。電気自動車のバッテリー製造の進化には、従来の工場からギガファクトリーの設立への移行が必要です。この成長産業にとってレーザープロセスが重要な役割を果たす理由をこの記事で読んでください。

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Wire bonding inspection with CHRocodile CLS 2

3D 計測

05/23/2023

Challenges Wire Bond Inspection

The article from Semi Engineering explores challenges in the wire bonding industry as seen by key players in the markets. Interesting insights and…

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Precitec won Prism Award 2023

3D 計測

02/03/2023

And the Prism Award 2023 goes to..

Precitec 3D Metrology wins prestigious Prism Award 2023.  

SPIE, the international society for optics and photonics, honored the Flying Spot Scanner…

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Enovasense sensor at work

3D 計測

01/25/2023

Precitec Acquires Majority Stake in Enovasense Thickness Sensor Company

Precitec Optronik has acquired a majority stake in the French start-up Enovasense with its technology to measure the thickness of all kinds of…

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Nominees for Test and Measurement category

3D 計測

11/16/2022

Precitec 3D Metrology is nominated for SPIE Prism Award

SPIE announces finalists for 2023 Prism Awards

The annual awards celebrate the best of photonics innovation in areas such as biomedical devices,…

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3D 計測

05/27/2021

Hand in hand for customised solutions

Article in Glass WorldWide April 2021

Precitec’s optical measuring technology is used throughout manufacturing industry for quality inspection and…

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3D 計測

05/27/2021

Non-contact thickness measurement of non-transparent components

Publication in the German Magazine InVision in April 2020
With the CHRocodile 2 DPS dual-channel sensor Precitec Optronik offers a stand-alone…

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Advertisement Boss Magazine Flying Spot Scanner

3D 計測

02/13/2020

Advertorial in Boss Magazine

Check out our advertorial ...

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CHRocodile 2 dps whitepaper

3D 計測

07/26/2019

In-Process Wafer Step Height Measurement

During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal…

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