간행물

3D 계측

02/01/2024

Dr. Markus Kogel-Hollacher is presenting a paper at this year´s Photonics West

Precitec Optronik Head of R&D and Photonics 100 honouree Dr. Markus Kogel-Hollacher is presenting a paper at this year's Photonics West.
He talked…

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3D 계측

12/13/2023

e-모빌리티 개발에 레이저 공정이 중요한 역할을 하는 이유는 무엇입니까?

포토닉스, 특히 레이저와 센서는 향후 배터리 시장에서 중요한 역할을 맡을 준비가 되어 있습니다. 전기차 배터리 제조의 발전을 위해서는 기존 공장에서 기가팩토리 설립으로의 전환이 필요합니다. 이 기사에서 레이저 공정이 성장하는 산업에서 중요한 역할을 하는 이유를…

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Wire bonding inspection with CHRocodile CLS 2

3D 계측

05/23/2023

Challenges Wire Bond Inspection

The article from Semi Engineering explores challenges in the wire bonding industry as seen by key players in the markets. Interesting insights and…

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Precitec won Prism Award 2023

3D 계측

02/03/2023

And the Prism Award 2023 goes to..

Precitec 3D Metrology wins prestigious Prism Award 2023.  

SPIE, the international society for optics and photonics, honored the Flying Spot Scanner…

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Enovasense sensor at work

3D 계측

01/25/2023

Precitec Acquires Majority Stake in Enovasense Thickness Sensor Company

Precitec Optronik has acquired a majority stake in the French start-up Enovasense with its technology to measure the thickness of all kinds of…

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Nominees for Test and Measurement category

3D 계측

11/16/2022

Precitec 3D Metrology is nominated for SPIE Prism Award

SPIE announces finalists for 2023 Prism Awards

The annual awards celebrate the best of photonics innovation in areas such as biomedical devices,…

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3D 계측

05/27/2021

Hand in hand for customised solutions

Article in Glass WorldWide April 2021

Precitec’s optical measuring technology is used throughout manufacturing industry for quality inspection and…

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3D 계측

05/27/2021

Non-contact thickness measurement of non-transparent components

Publication in the German Magazine InVision in April 2020
With the CHRocodile 2 DPS dual-channel sensor Precitec Optronik offers a stand-alone…

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Anzeige Boss Magazine Flying Spot Scanner

3D 계측

02/13/2020

Advertorial in Boss Magazine

Check out our advertorial ...

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CHRocodile 2 dps whitepaper

3D 계측

07/26/2019

In-Process Wafer Step Height Measurement

During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal…

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