出版物

3D 計量

02/01/2024

Dr. Markus Kogel-Hollacher is presenting a paper at this year´s Photonics West

Precitec Optronik Head of R&D and Photonics 100 honouree Dr. Markus Kogel-Hollacher is presenting a paper at this year's Photonics West.
He talked…

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3D 計量

12/13/2023

為什麼雷射工藝在電動車的發展中發揮如此重要的作用?

光子學,特別是雷射和感測器,將在未來幾年在電池市場中發揮重要作用。電動車電池製造的發展需要從傳統工廠過渡到建立超級工廠。請閱讀本文,了解為什麼雷射工藝在這個不斷發展的行業中發揮著至關重要的作用。

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Wire bonding inspection with CHRocodile CLS 2

3D 計量

05/23/2023

Challenges Wire Bond Inspection

The article from Semi Engineering explores challenges in the wire bonding industry as seen by key players in the markets. Interesting insights and…

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Precitec won Prism Award 2023

3D 計量

02/03/2023

And the Prism Award 2023 goes to..

Precitec 3D Metrology wins prestigious Prism Award 2023.  

SPIE, the international society for optics and photonics, honored the Flying Spot Scanner…

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Enovasense sensor at work

3D 計量

01/25/2023

Precitec Acquires Majority Stake in Enovasense Thickness Sensor Company

Precitec Optronik has acquired a majority stake in the French start-up Enovasense with its technology to measure the thickness of all kinds of…

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Nominees for Test and Measurement category

3D 計量

11/16/2022

Precitec 3D Metrology is nominated for SPIE Prism Award

SPIE announces finalists for 2023 Prism Awards

The annual awards celebrate the best of photonics innovation in areas such as biomedical devices,…

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3D 計量

05/27/2021

Hand in hand for customised solutions

Article in Glass WorldWide April 2021

Precitec’s optical measuring technology is used throughout manufacturing industry for quality inspection and…

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3D 計量

05/27/2021

Non-contact thickness measurement of non-transparent components

Publication in the German Magazine InVision in April 2020
With the CHRocodile 2 DPS dual-channel sensor Precitec Optronik offers a stand-alone…

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Anzeige Boss Magazine Flying Spot Scanner

3D 計量

02/13/2020

Advertorial in Boss Magazine

Check out our advertorial ...

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CHRocodile 2 dps whitepaper

3D 計量

07/26/2019

In-Process Wafer Step Height Measurement

During the grinding process the wafer thickness needs to be controlled in real time. A non-contact, optical measurement technology is the ideal…

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